APPLIED MATERIALS CMP Module Process Engineer IV - (E4) in Hillsboro, OR

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Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$116,000.00 - $159,500.00

Location:

Boise,ID, Hillsboro,OR

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Role Responsibilities

  • Must be a technical expert with 10 years’ experience in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background.

  • Must have data analytics background for performing analysis to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration related problems.

  • Lead discussions with customers to understand their High Value Problems (HVP), propose and implement new Continuous Improvement Projects (CIP), capture learning to maximize service opportunities and implement the solutions to improve customer KPI's

  • Increases CSA value through defect / variability / COO reduction and PM /process Cpk / matching / Output optimization.

  • Identifies opportunities for CSA renewal /upsell /penetration

  • Demonstrates & drives the adoption of new service technologies including FabVantage Offerings at the customer site through Demos, on site evaluations and Joint Development Programs

  • Resolves complex tool issues utilizing analytics, equipment, and process knowledge and systematic FabVantage troubleshooting methodologies for effective root cause diagnostics and issues resolution. Can Issue the report and present to customer which including explain the priority and provide the suggestion based on the compare BOM, EC, FSS data and FV360 for two products.

  • Mentor/Lead junior level MPE's

  • Advanced integration knowledge

  • Domain knowledge of 3 or more types of CMP processes and familiarity with Applied equipment.

  • Lead and contribute to CMP network of experts and Community of Practice

Qualifications:

  • BS - Engineering

  • 10 years of experience in Chemical Mechanical Planarization (CMP) Process

  • Wafer Fab Process / Equipment experience

  • Communicates complex ideas, anticipates potential objections, and persuades others, often at senior levels, to adopt a different point of view

  • Regarded as the technical expert in CMP Unit Process and Wafer Fab operations

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at AccommodationsProgram@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

Must be a technical expert with 10 years’ experience in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background. Must have data analytics background for performing analysis to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration related problems. Lead discussions with customers to understand their High Value Problems (HVP), propose and implement new Continuous Improvement Projects (CIP), capture learning to maximize service opportunities and implement the solutions to improve customer KPI's. Increases CSA value through defect / variability / COO reduction and PM /process Cpk / matching / Output optimization. Identifies opportunities for CSA renewal /upsell /penetration. Demonstrates & drives the adoption of new service technologies including Fab. Vantage Offerings at the customer site through Demos, on site evaluations and Joint Development Programs. Resolves complex tool issues utilizing analytics, equipment, and process knowledge and systematic Fab. Vantage troubleshooting methodologies for effective root cause diagnostics and issues resolution. Can Issue the report and present to customer which including explain the priority and provide the suggestion based on the compare BOM, EC, FSS data and FV 360 for two products. Mentor/ Lead junior level MPE's. Advanced integration knowledge. Domain knowledge of 3 or more types of CMP processes and familiarity with Applied equipment. Lead and contribute to CMP network of experts and Community of Practice. Qualifications: BS - Engineering 10 years of experience in Chemical Mechanical Planarization (CMP) Process. Wafer Fab Process / Equipment experience. Communicates complex ideas, anticipates potential objections, and persuades others, often at senior levels, to adopt a different point of view. Regarded as the technical expert in CMP Unit Process and Wafer Fab operations. Additional Information. Time Type:Full time. Employee Type:Assignee / Regular. Travel:Yes, 25% of the Time.
search terms: Process Engineer+Engineer
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